Sealing glue for car charging piles

Mainly used for encapsulation protection of module power supplies and circuit boards with high-power electronic components and high requirements for heat dissipation and temperature resistance. Such as switch power supplies, transformers, power modules, automotive HID power supplies, automotive ignition system module power supplies, network transformers, etc.

Due to the presence of flame-retardant and thermally conductive materials in colloids, long-term storage of colloids may result in layering and filler precipitation. Before use, mix the A/B components evenly before placing them in a mixing tank at a mass ratio of 1:1.

Pour the mixed adhesive material into the device to be sealed. Generally, vacuum defoaming is not necessary. If high thermal conductivity is desired, it is recommended to vacuum defoam before pouring. It can be cured at room temperature or by heating. The curing speed of glue is closely related to the curing temperature, and the curing time will be prolonged at lower temperatures. It is recommended to use heating to cure, curing at 80 ℃ for 15-30 minutes, and generally taking about 5 hours to cure at room temperature.

Unused adhesive should be stored in a sealed container. The storage period is 10 months (25 ℃). The mixed adhesive should be used up at once to avoid waste.

This product is non hazardous, but should not be ingested or seen.

Transportation: There are no regulations for domestic (CN-GB) or international (IMO, IATA, UN) transportation. Belonging to non dangerous goods.

The adhesive solution may experience poisoning when exposed to the following chemicals (trace amounts of the following substances will not affect curing): (Poisoning: The adhesive cannot cure)

·N. Organic compounds P and S.

·Ionic compounds of elements such as Sn, Pb, Hg, As, etc.

·Containing alkynes and multi vinyl compounds.

·To avoid the above phenomenon, try to wipe off the residual rosin on the circuit board as much as possible and use solder with low lead content.

Before curing: ① Appearance: gray (A)/white (B) flowing body ② Color after mixing: gray ③ Component A viscosity (mpa. s, 25 ℃): 4200-4500 (adjustable)

④ B component viscosity (mpa. s, 25 ℃): 4200-4500 (adjustable)

Operational performance: ① two-component mixing ratio (weight ratio) A: B --1:1 ② viscosity after mixing (mpa. s): 4200-4500 (adjustable) ③ surface drying time (min, 25 ℃): 30-50 (adjustable)

④ Curing time (min, 25 ℃): 120-180 (adjustable) ⑤ Relative specific gravity: 1.55 ± 0.05

After curing: ① Hardness (shore A): 45 ± 5 ② Thermal conductivity [W (m · K)]: 0.5-0.7 ③ Dielectric strength (kV/mm): ≥ 18 ④ Dielectric constant (100MHz): 2.8-3.0

⑤ Volume resistivity (Ω· cm): ≥ 1.0 × 1013 ⑥ Linear expansion coefficient [m/(m · K)]: ≤ 2.2 × 10-4 ⑦ Flame retardant grade: 94V0

CS-9813G potting adhesive is a two-component addition molded flame-retardant and thermally conductive silicone potting adhesive, with the following characteristics:

The A component of this product is a gray viscous liquid, and the B component is a white viscous liquid. The two components can be stored for a long time before mixing.

This product has good thermal conductivity (heat dissipation), insulation, elasticity, corrosion resistance, weather resistance, flame retardancy and other characteristics. After solidification, the colloid can be used over a wide temperature range.

＊ It does not shrink during curing, and has good waterproof, moisture-proof and anti-aging properties.

Compliant with the EU ROHS directive requirements.