CS-9808 Automotive HID Sealing Adhesive Series

Mainly used for sealing high-power electronic components, module power supplies with high requirements for heat dissipation and temperature resistance, and non fully sealed circuit boards and other electronic components, playing a role in bonding, sealing, waterproofing, and moisture resistance. Such as switch power supplies, transformers, power modules, automotive HID power supplies, automotive ignition system module power supplies, network transformers, etc. And the encapsulation of electronic components such as non fully sealed circuit boards plays a role in bonding, sealing, waterproofing, and moisture resistance.

Due to the presence of fillers and thermal conductive materials in colloids, long-term storage of colloids may result in layering and sedimentation of fillers. Before use, mix the A/B components evenly before placing them in a mixing tank at a mass ratio of 10:1.

Pour the mixed adhesive into the device that needs to be sealed. Generally, vacuum defoaming is not necessary. If conditions permit, it is recommended to vacuum defoam before pouring. This product is room temperature curing type. The curing speed of adhesive is not closely related to the curing temperature, but to the proportion and content of B agent. The larger the B agent, the faster the curing speed (it is recommended to adjust the range of B agent from 100:7-100:12). It usually takes about 8 hours to cure at room temperature.

Unused adhesive should be stored in a sealed container. The storage period is 6 months (25 ℃). The mixed adhesive should be used up at once to avoid waste.

This product is non hazardous, but should not be ingested or seen.

Transportation: There are no regulations for domestic (CN-GB) or international (IMO, IATA, UN) transportation. Belonging to non dangerous goods.

Before curing: ① Appearance: black (A)/transparent (B) flowing body ② Color after mixing: black ③ Component A viscosity (mpa. s, 25 ℃): 3500-5500 (adjustable)

④ B component viscosity (mpa. s, 25 ℃): 20-40

Operational performance: ① two-component mixing ratio (weight ratio) A: B --100:10 ② viscosity after mixing (mpa. s): 2500-4000 ③ surface drying time (min, 25 ℃): 50-70 (adjustable)

④ Curing time (min, 25 ℃): 240-480 (adjustable) ⑤ Curing time (min, 80 ℃)

After curing: ① Hardness (shore A): 30-40 ② Thermal conductivity [W (m · K)]: 0.4-0.6 ③ Dielectric strength (kV/mm): ≥ 22 ④ Dielectric constant (100MHz): 3.0-3.4

⑤ Volume resistivity (Ω· cm): ≥ 1.0 × 1015 ⑥ Elongation at break (%): 100-150 ⑦ Maximum tensile strength (Kgf/cm2): 1.6

⑧ Temperature range for use (℃): -50 ℃ -200 ℃

CS-9808 sealant is a two-component silicone sealant with the following characteristics:

The A component of this product is a black viscous liquid, and the B component is a transparent liquid. The two components can be stored for a long time before mixing.

This product has good thermal conductivity (heat dissipation), insulation, elasticity, corrosion resistance, weather resistance and other characteristics. After solidification, the colloid can be used over a wide temperature range.

＊ It does not shrink during curing, and has good waterproof, moisture-proof and anti-aging properties.

Compliant with the EU ROHS directive requirements.